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  2. Division B: The "Matter" Desk (AI Hardware & Materials)
  3. Datacenter Compute & Thermal Infrastructure (IGN-H01..H03)

Datacenter Compute & Thermal Infrastructure (IGN-H01..H03)

Thermal management and high-speed optical interconnect components designed for high-density AI accelerator racks and modern liquid-cooled datacenters.

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[IGN-H01] OSFP / QSFP-DD 800G Optical Transceivers — DR8 / FR8
IGN-H01

OSFP / QSFP-DD 800G Optical Transceivers — DR8 / FR8

800G OSFP/QSFP-DD optical transceivers (DR8 / FR8 variants) for AI cluster top-of-rack interconnects.
[IGN-H02] Liquid Cooling Manifolds — Direct-to-Chip AI Server Grade
IGN-H02

Liquid Cooling Manifolds — Direct-to-Chip AI Server Grade

Direct-to-chip stainless steel 316L liquid cooling distribution manifolds for high-density AI server racks.
[IGN-H03] Universal Quick Disconnects (UQD) Couplings
IGN-H03

Universal Quick Disconnects (UQD) Couplings

Universal Quick Disconnect (UQD) couplings for zero-drip AI server cooling loops. Push-to-connect specification by enquiry.