TECHNICAL SPECIFICATION · IGN-B08
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Technical Data & Commercial Terms
Category: Pillar B: Digital Foundation Materials · Commercial Status: Allocation / Inquiry-Only
1. Physical & Chemical Specification
| Property | Technical Specification / Nominal Parameter |
|---|---|
| Growth Method | Czochralski (CZ) monocrystalline |
| Diameter / Thickness | 300.0 mm ± 0.2 mm / 775 µm ± 20 µm |
| Orientation | <100> ± 0.5° |
| Type / Dopant | p-type (Boron) / n-type (Phosphorus) |
| Resistivity | 1–10 Ω·cm (Standard) / Tailored per customer spec |
| Total Thickness Variation (TTV) | < 1.5 µm, Warp < 25 µm |
| Surface Quality | Double Side Polished (DSP), particles < 0.065 µm ≤ 20 counts/wafer |
2. Customs & Standards Compliance
- EU Tariff (TARIC / HS Code):
3818 00 10 (Silicon Wafers, Doped/Polished) - Standards & Test Methods: SEMI M1-0307, SEMI MF1530
- Quality Certificates: SEMI compliance inspection cert, particle map, resistivity radial map
- ℹ️ Customs classification, origin information and applicable documentation are confirmed for the specified product and transaction. Available inspection and compliance documents are listed in the quotation. Any applicable CBAM obligations depend on the product classification and import arrangement.
3. Procurement & Logistics Parameters
- Minimum Order Quantity (MOQ): 1 FOUP (25 wafers)
- Standard Packaging: Cleanroom sealed 25-wafer FOUP / FOSB cassette in moisture-barrier bag
- Typical Lead Time: 2–3 weeks European safety stock
- Delivery Incoterms (2020): DDP European Semiconductor Fab
- Hazardous Materials Status: Non-hazardous semiconductor substrates
Quality Assurance & Assays: Inspection certificates (e.g. EN 10204 3.1) and accredited independent assayer reports (e.g. SGS / Alfred H Knight) are provided per contract specification and agreed order terms. EU REACH and statutory documentation are aligned during quotation.