TECHNICAL SPECIFICATION · IGN-B09
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Technical Data & Commercial Terms
Category: Pillar B: Digital Foundation Materials · Commercial Status: Allocation / Inquiry-Only
1. Physical & Chemical Specification
| Property | Technical Specification / Nominal Parameter |
|---|---|
| Growth Method | Czochralski (CZ) monocrystalline |
| Diameter / Thickness | 200.0 mm ± 0.2 mm / 725 µm ± 20 µm |
| Orientation | <100> or <111> ± 0.5° |
| Type / Dopant | p-type (Boron) / n-type (Phosphorus/Antimony) |
| TTV / Bow / Warp | TTV < 2.0 µm, Bow < 20 µm, Warp < 30 µm |
| Surface Polish | Single Side Polished (SSP) or Double Side Polished (DSP) |
2. Customs & Standards Compliance
- EU Tariff (TARIC / HS Code):
3818 00 10 (Silicon Wafers, Doped/Polished) - Standards & Test Methods: SEMI M1 compliant
- Quality Certificates: EN 10204 3.1 MTC, wafer flatness & thickness geometry log
- ℹ️ Customs classification, origin information and applicable documentation are confirmed for the specified product and transaction. Available inspection and compliance documents are listed in the quotation. Any applicable CBAM obligations depend on the product classification and import arrangement.
3. Procurement & Logistics Parameters
- Minimum Order Quantity (MOQ): 1 cassette (25 wafers)
- Standard Packaging: Sealed cleanroom 25-wafer cassette
- Typical Lead Time: 2–3 weeks European stock
- Delivery Incoterms (2020): DDP European facility
- Hazardous Materials Status: Non-hazardous solid substrate
Quality Assurance & Assays: Inspection certificates (e.g. EN 10204 3.1) and accredited independent assayer reports (e.g. SGS / Alfred H Knight) are provided per contract specification and agreed order terms. EU REACH and statutory documentation are aligned during quotation.