TECHNICAL SPECIFICATION · IGN-D07
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Technical Data & Commercial Terms
Category: Pillar D: Niche Manufacturing Inputs · Commercial Status: Allocation / Inquiry-Only
1. Physical & Chemical Specification
| Property | Technical Specification / Nominal Parameter |
|---|---|
| Chemical Base | High-thermal conductivity silica-filled epoxy resin system |
| Filler Content (Fused Silica) | 85% – 90% by weight |
| Coefficient of Thermal Expansion (CTE-1) | 8–12 ppm/°C (matched to silicon die) |
| Glass Transition Temp (Tg) | > 160°C (TMA) |
| Thermal Conductivity | > 1.2 W/(m·K) |
| Application | CoWoS 2.5D/3D advanced chiplet packaging encapsulation and fine-pitch underfill |
2. Customs & Standards Compliance
- EU Tariff (TARIC / HS Code):
3907 30 00 (Epoxide Resins) - Standards & Test Methods: SEMI G13, ISO 9001
- Quality Certificates: Certificate of Analysis (CoA), viscosity curve, ion chromatography (Cl⁻ < 5 ppm)
- ℹ️ Customs classification, origin information and applicable documentation are confirmed for the specified product and transaction. Available inspection and compliance documents are listed in the quotation. Any applicable CBAM obligations depend on the product classification and import arrangement.
3. Procurement & Logistics Parameters
- Minimum Order Quantity (MOQ): 100 kg (Granular compound) / 25 syringes (Liquid MUF)
- Standard Packaging: Dry ice cold-chain shipping (-40°C) for liquid MUF / sealed drums for granular
- Typical Lead Time: 2–3 weeks specialized allocation
- Delivery Incoterms (2020): DDP European Semiconductor Packaging Facility
- Hazardous Materials Status: Non-hazardous refrigerated chemical formulation
Quality Assurance & Assays: Inspection certificates (e.g. EN 10204 3.1) and accredited independent assayer reports (e.g. SGS / Alfred H Knight) are provided per contract specification and agreed order terms. EU REACH and statutory documentation are aligned during quotation.